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Wire Cutting Line

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XPS downstream system
Wire Cutting Line
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The DDL Wire Cutting Line is designed for cutting thin, shaped XPS boards. The cutting system is based on heated, oscillating metal wires designed to cut XPS boards accurately and continuously, leaving the surfaces clean and smooth even on extra-thin boards.

All adjustments to the cutting line are controlled automatically via job recipes. The set parameters are automatically recalled based on the product required, thereby ensuring process repeatability and reducing set-up times.

Automatic wire positioning contributes to the accuracy and dimensional consistency in the finished board.

The Wire Cutting Line is designed to process stacks of boards measuring up to 1200 × 600 mm (length × height) and to handle sheet thicknesses as thin as 5 mm.

  • cutting speed up to 1.5 m/min;
  • 15 mm oscillation stroke;
  • 20 Hz oscillation frequency;
  • low noise levels during operation.

Want to consider integrating the DDL wire cutting system into your plant?

Speak with a technician