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XPS Thermobonding

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XPS downstream system
Thermobonding
TB
IMG 20220819 151214
IMG 20210802 122759
4855

The DDL Thermobonding system has been developed to meet specific application requirements in the XPS sector and introduces a heat welding solution for the boards within the downstream process.

 

This technology is the result of a targeted design process, which has led to the development of an original system able to expand the range of applications for XPS boards while maintaining process continuity.

Thermobonding allows two or three XPS boards to be welded together in a single step and can achieve an overall height of up to 450 mm.

The welding process is obtained by controlled application of heat, based on the characteristics of the product and the processing specifications.

Thanks to its compact design, the Thermobonding station can be easily integrated into an existing post-processing line without requiring any major changes to the factory layout.

 

When welding is not required, the machine can be automatically set to the bypass mode. The bypass configuration is built into the machine and does not require any additional space.

Want to integrate the DDL Thermobonding station into your downstream system?

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