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Thickness Measurement

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XPS downstream system
Thickness Measurement
MISURATORE LASTRE MOBILE e1770129282531
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DDL Thickness Measurement systems provide for continuous monitoring of the thickness of the XPS boards along the post-processing line.

Combined with our in-house mechanical and electronic expertise, the experience we have acquired in the XPS sector has led to the development of measurement systems able to enhance the stability and improvement of the production process.

The system scans five areas of the board per second and provides the measured thickness value for each one.
If the measured values are outside the parameters set by the operator, the system immediately signals the condition via a visual and audible alarm.

This enables prompt action to be taken to correct the process, thereby reducing waste and faulty production.

Laser thickness gauges are available in the fixed or portable versions, depending on monitoring requirements and line layout.

 

The measurements provided by the portable systems are more accurate, while the fixed systems are an effective solution for continuous process monitoring along the post-processing line.

All measurement data are stored and can be consulted later on for a detailed analysis of the production process.

  • measurement accuracy is 0.1 mm;
  • acquisition speed up to 100 readings per second

Want to integrate a thickness monitoring system into your XPS system?

Speak with a technician